Advanced electronics packaging
5 European H2020 organizations list this as part of their work — 2 as their primary capability.
Most active in this area
- JSR MICRO NV
Semiconductor materials and photoresist supplier contributing to Europe's most advanced chip manufacturing pilot lines, from 3nm to 2nm nodes.
“APPLAUSE focused on photonics/optics/electronics packaging for sensors and transceivers; BASMATI on nanomaterial inks for printed electronics.”
BE6 projects - ICOS VISION SYSTEMS NV
Semiconductor inspection and metrology specialist providing vision-based quality control for chip manufacturing, advanced packaging, and photonics integration.
“Coordinated APPLAUSE, focused on photonics, optics, and electronics packaging for sensors and transceivers.”
PrimaryBE5 projects - PRECORDIOR OY
Finnish health-tech SME developing cardiac monitoring apps built on MEMS and photonics sensor technology.
“APPLAUSE focuses on advanced packaging for photonics, optics, and electronics for low-cost European manufacturing.”
SMEFI3 projects - WURTH ELEKTRONIK GMBH & CO KG
German electronics manufacturer specializing in advanced packaging for photonic sensors, MEMS, and ruggedized industrial IoT components.
“Both APPLAUSE and CHARM are explicitly packaging-focused projects — APPLAUSE targets low-cost packaging for photonics and optics, CHARM targets packaging for harsh-environment tolerant smart systems.”
PrimaryDE2 projects - HUAWEI TECHNOLOGIES RESEARCH & DEVELOPMENT BELGIUM
Huawei's Belgian R&D unit specialising in micro-transfer-printing for heterogeneous integration of semiconductor components at wafer scale.
“Participation in two ECSEL-IA and RIA schemes signals capability in bridging research-stage processes with manufacturable electronics packaging.”
SMEBE2 projects